Evaluation and Enhancement of Thermal Transport Characteristics of Metal Matrix Composites and Contact Interfaces
G.V Krishna Reddy1, H. S. Monohar N. Chikkanna2, B. Umamaheswar Goud3
1Dr. G.V. Krishna Reddy, Department of Mechanical Engineering of Govt. Polytechnic, Channasandra . Bangalore, (Karnataka) India.
2Dr. H.S. Monohar. Associate Professor, SEA College of Engineering, Bangalore, K.A, India.
3Dr. N. Chikkanna, Government Engineering College, Hoovina hadagali, Bellary, (Karnataka) India.
4Dr. B. Uma maheshwar Goud, as Director of Admissons, Jawaharlal Nehru Technological University- Anantapur Andhra Pradesh.India
Manuscript received on March 11, 2014. | Revised Manuscript received on March 15, 2014. | Manuscript published on March 25, 2014. | PP:42-49 | Volume-2 Issue-5, March 2014. | Retrieval Number: E0682032514/2014©BEIESP
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© The Authors. Published By: Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: In this work, effort has been made in the evaluation and enhancement of thermal transport characteristics of metal matrix composites and contact interfaces. The thermal management systems are important in today’s faster growing industrial needs which are demanding the high end processors with highest speed and reliability of performance. The thermal management systems are used for applications like central processing unit (CPU) cooling, cooling of electronics circuit boards, cooling of mechanical and automobile systems like engine cooling. However, this work focuses on thermal management systems related to CPU cooling. In this work, initially, the importance and motivation behind the evaluation of the thermal characteristics for the MMC’s as well as TIMs. Thermal contact resistance in heat transfer applications are presented with examples. The heat transfer phenomenon at the interfaces is detailed with the classification based on contact criteria. The development of new MMC’s was detailed along with the different compositions of the MMCs. For this, initially, baseline materials were explained in detail along their thermal properties. Six MMC’s have been proposed with varying compositions of aluminum and silicon carbide. Aluminum was varied in percentage composition from 25% to 35% . The MMC’s were evaluated for the properties like thermal conductivity, specific heat, thermal diffusivity, CTE, density and Young’s modulus. Also, the variation of these properties with respect to temperature is evaluated. Finally recommendations are given for the MMC’s based on the required property criteria of the heat source material. As a second approach, the thermal contact resistance models were developed. A measurement system for contact resistances has been established by performing measurements on the known properties of the greases. Application of thermal greases is given in detail. The measurement system was established by conducting the experiments.
Keywords: Heat sink, Aluminum, silicon carbide, Thermal grease, Thermal interface material, contact interface.