Sale Event Infrastructure Provisioning and Execution Flow in FinTech Ecosystems
Ashok Kumar A R1, Kiran U*2
1Dr. Ashok Kumar R. A., Department of Computer Science and Engineering, R. V. College of Engineering, Bengaluru (Karnataka), India.
2Kiran U, Department of Computer Science and Engineering, R. V. College of Engineering, Bengaluru (Karnataka), India.
Manuscript received on 06 June 2026 | First Revised Manuscript received on 08 July 2026 | Second Revised Manuscript received on 20 July 2026 | Manuscript Accepted on 15 August 2026 | Manuscript published on 30 August 2026 | PP: 1-9 | Volume-14 Issue-9, August 2026 | Retrieval Number: 100.1/ijese.K261513111025 | DOI: 10.35940/ijese.K2615.13111025
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open-access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: In FinTech ecosystems, sale events such as festive offers or cashback campaigns require robust, scalable infrastructure to handle high transaction volumes without disruption. This paper presents a comprehensive framework for provisioning and managing infrastructure during such events, starting with merchant TPS requirements and proceeding through engineering approval based on readiness. The system includes detailed sale configuration, real-time load testing to validate capacity, auto-scaling based on statistical metrics, and structured flows aligned with payment processing. A maker-checker mechanism ensures controlled updates, while instance-level observability supports continuous monitoring across all applications. The approach also includes automated email triggers to stakeholders 12 hours before the sale and the ability to fetch BAU metrics for infrastructure insights. Through a case study and flow-based analysis, the paper demonstrates how FinTech platforms can enhance reliability, readiness, and execution precision during critical sale events.
Keywords: Transaction Per Second (TPS), Business as Usual (BAU), FinTech.
Scope of the Article: Computer Science and Engineering